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OPUTE Thermally Conductive Double-Sided Adhesive Tape for Electronics & Heat Sinks – Custom Sizes
$0.99
Thermally Conductive Double-Sided Tape
OPUTE Thermally Conductive Double-Sided Tape is designed for heat transfer and adhesive bonding between electronic components and heat sinks. Custom widths, thicknesses, roll lengths and die-cut shapes are available for industrial assembly and converting applications.
≥1.0
W/m·K Conductivity
150 µm
Typical Thickness
4 kV
Voltage Resistance
Custom
Sizes & Die Cutting
Key Features & Benefits
- Thermal conductivity and electrical insulation
- Adhesive bonding for heat sinks and electronic components
- Soft and conformable structure for uneven contact surfaces
- Suitable for industrial converting and electronic assembly
- Custom widths, thicknesses and die-cut shapes available
Typical Applications
- IC heat sink fixing
- Bonding heat sinks to chips
- Securing heat sinks to heat-generating components
- LED lighting and electronic assemblies
- Industrial electronic equipment
Technical Specifications
Typical properties of the catalog reference grade.
| Property | Typical Value | Test Method |
|---|---|---|
| Total Thickness | 150 µm | GB7125-1998 |
| Film Thickness | 90 µm | GB7125-1997 |
| Adhesion | 1200–1800 g/25 mm | GB/T2792-1997 |
| Tensile Strength | ≥180 MPa | GB/T1040.3 |
| Thermal Conductivity | ≥1.0 W/m·K | GB/T1040.3 |
| Voltage Resistance | 4 kV | — |
| Heat Resistance | 135°C / 30 min, no adhesive residue | CE-021 |
Available Sizes & Customization
- Thickness: Catalog lists 100 / 700 µm options; confirm the selected grade.
- Width: Custom widths available.
- Roll Length: According to customer requirements.
- Processing: Precision slitting, laminating and die-cutting.
Looking for a Customized Thermal Tape Solution?
OPUTE provides customized thermal adhesive tapes for electronics and industrial applications. Contact us for technical specifications, samples and quotation support.
Request a QuoteNote: Technical values are typical reference data. Confirm specifications and test methods for the selected product grade.