OPUTE 1 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
OPUTE 1 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
TC-10 Silicone Thermal Putty
OPUTE TC-10 is a single-component, thixotropic silicone-based thermal putty formulated with metal oxides and silicone resin. With a thermal conductivity of 1.0 ± 0.2 W/m·K, it is designed to fill air gaps and uneven interfaces between heat-generating electronic components and heat sinks. The material remains soft over time and offers electrical insulation, water resistance, low oil separation and low volatility.
Key Features & Benefits
- Thermal Gap Filling: Fills gaps and irregular surfaces between heat sources and heat sinks to improve thermal contact.
- Single-Component Formula: Ready for application without A/B component mixing.
- Soft & Thixotropic: Maintains a soft consistency over time and conforms to uneven surfaces.
- Low Oil Separation: Oil separation of ≤1% after 24 hours at 150°C.
- Low Volatility: Volatile content of ≤0.2% after 24 hours at 150°C.
- Electrical Insulation: Volume resistivity of ≥1.0 × 10⁸ Ω·cm.
- Water Resistance: Silicone-based formulation with water-resistant properties.
Applications
TC-10 is intended for thermal gap filling between electronic heat sources and heat sinks. Typical components identified in the TDS include:
- Integrated circuits (ICs)
- Transistors and electronic power components
- Processors and electronic assemblies
- Heat sources and heat sinks
- Uneven mating surfaces requiring thermal gap filling
Customers should verify thermal performance and material compatibility under actual assembly conditions before mass production.
Technical Specifications
| Property | TC-10 | Test Method |
|---|---|---|
| Product Type | Single-Component Silicone Thermal Putty | — |
| Appearance | White Putty | Visual |
| Thermal Conductivity | 1.0 ± 0.2 W/m·K | ASTM D5470 |
| Thermal Resistance | 0.2 °C·cm²/W | ASTM D5470 |
| Oil Separation (150°C × 24h) | ≤1% | SH/T 0324-1992 |
| Volatile Content (150°C × 24h) | ≤0.2% | SH/T 0337-92 |
| Volume Resistivity | ≥1.0 × 10⁸ Ω·cm | GB/T 1692-2008 |
| Operating Temperature | -40°C to 160°C | — |
| Material Composition | Metal Oxides & Silicone Resin | — |
Packaging & Storage
- Standard Packaging: 700 g/cartridge and 30 kg/drum.
- Custom Packaging: Other packaging sizes can be discussed according to customer requirements.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: 1 year under the specified storage conditions.
- Transportation: Non-dangerous goods; transported as general chemicals.
Application & Handling Guidelines
- Ensure all contact surfaces are clean and dry before application.
- Apply the material to the required thermal interface gap.
- Keep any unused material sealed before returning it to storage.
- Perform application-specific testing before production use.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE to discuss TC-10 thermal putty, electronic gap filling requirements, available packaging, samples and technical documentation. Share your application details with our team to evaluate suitable thermal interface materials.
Request a QuoteTechnical information is based on OPUTE TC-10 Technical Data Sheet, revision A/1, dated March 3, 2026. Product suitability should be confirmed through application-specific testing.