OPUTE 1.0 W/m·K Silicone Thermal Gel – Thermal Gap Filler for Electronic Components & LED Cooling
OPUTE 1.0 W/m·K Silicone Thermal Gel – Thermal Gap Filler for Electronic Components & LED Cooling
TF-10 Two-Component Thermal Gel
OPUTE TF-10 is a two-component thermal gap-filling material with a thermal conductivity of 1.0 W/m·K. Designed to fill gaps between heat-generating components and heat sinks, it provides efficient heat transfer, good conformability and low compression force. The material can be applied through dispensing and maintains its shape after application. Once cured, it can be peeled off for removal.
Key Features & Benefits
- Efficient Heat Transfer: Thermal conductivity of 1.0 W/m·K helps transfer heat between components and cooling surfaces.
- Low Compression Force: Good conformability helps the material fit closely against mating surfaces.
- Shape Stability: Dispensed gap-filling material maintains its form after application.
- Wide Operating Temperature Range: Designed for use from -50°C to 200°C.
- Removable After Curing: The cured material can be peeled off for removal.
- Two-Component System: A and B components are mixed at a 1:1 ratio.
Applications
TF-10 is intended for thermal gap filling between heat sources and heat sinks. Potential electronic applications include:
- Electronic components and heat sinks
- Power electronics thermal interfaces
- Electronic modules requiring conformable gap filling
- Heat-generating assemblies with uneven mating surfaces
Specific application suitability should be verified through testing under actual operating conditions.
Technical Specifications
| Property | TF-10 | Test Method |
|---|---|---|
| Component System | Two-Component (A+B) | — |
| Color Before Mixing | A: White / B: Pink | Visual |
| Viscosity Before Mixing | A: 250,000 / B: 250,000 mPa·s | ASTM D2196 |
| Mixing Ratio (A:B) | 1:1 | — |
| Color After Mixing | Grayish White | Visual |
| Thermal Conductivity | 1.0 W/m·K | ASTM D5470 |
| Thermal Resistance (@20 psi, 1 mm) | 2.2 °C·in²/W | ASTM D5470 |
| Hardness | 35–60 Shore 00 | ASTM D2240 |
| Density | 2.1 g/cm³ | ASTM D792 |
| Extrusion (90 psi, 50 cc, 1 min) | 40 (unit not specified in TDS) | — |
| Dielectric Breakdown Strength | 11.2 kV/mm | ASTM D149 |
| Dielectric Constant (@1 MHz) | 6.79 | ASTM D150 |
| Operating Temperature | -50°C to 200°C | — |
| Flammability Rating | UL94 V-0 (TDS stated) | GB/T 10707-2008 |
Mixing & Curing
TF-10 consists of two components that should be mixed at an A:B ratio of 1:1. The TDS lists the following curing conditions:
- 25°C: 30 minutes (as stated in TDS)
- 100°C: 120 minutes (as stated in TDS)
Please confirm the applicable curing schedule with OPUTE technical support before processing.
Packaging & Storage
- Standard Packaging: 50 ml, 100 ml and 300 ml per cartridge.
- Custom Packaging: Other packaging configurations available upon request, subject to confirmation.
- Shelf Life: 6 months.
- Storage: Store sealed in a cool, dry environment.
- Transportation: Classified as non-dangerous goods according to the product TDS.
Application & Handling Guidelines
- Ensure that the surfaces to be covered are clean and dry.
- Mix components A and B at the specified 1:1 ratio.
- Apply the mixed material to the required thermal gap.
- Follow the curing conditions confirmed by OPUTE technical support.
- Reseal unused material before storage.
- Perform application testing before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE to discuss TF-10 thermal gel, application gap dimensions, dispensing requirements, packaging options and technical specifications. Our team can help evaluate the material for your electronic thermal management application.
Request a QuoteTechnical information is based on OPUTE TF-10 Technical Data Sheet, revision A/0, dated March 22, 2024. Customers should conduct application-specific testing before use.