Adhesive & Thermal Management Solutions for On-Board Chargers
Silicone potting compounds, thermal interface materials and bonding solutions for electric vehicle on-board charger assemblies.
What Is an On-Board Charger?
An On-Board Charger (OBC) is a power electronic system installed in an electric vehicle. Its main function is to convert AC power from an external charging source into DC power suitable for charging the vehicle battery.
OBC assemblies typically contain power semiconductor devices, transformers, inductors, capacitors, control electronics and heat-dissipating structures.
These components generate heat during operation and may require suitable thermal interface, insulation, bonding and protection materials.
Adhesive Application Areas Inside an On-Board Charger
Different locations within an OBC assembly may require different adhesive or thermal management materials, depending on the electrical, mechanical and thermal design.
Key Material Requirements for On-Board Chargers
OBC materials must be selected with consideration for heat dissipation, electrical safety and long-term mechanical stability.
Thermal Management
Suitable thermal materials improve heat transfer from power devices and other heat-generating components toward cooling structures.
Electrical Insulation
Properly selected insulating materials help support electrical isolation and protection in high-voltage power electronic assemblies.
Mechanical Reliability
Adhesives and encapsulation materials can help stabilize selected components exposed to vibration and thermal cycling.
Adhesive & Thermal Material Applications in OBC Assemblies
OPUTE provides material options for selected potting, thermal gap filling and thermal interface applications.
Thermally Conductive Silicone Potting Compound
Thermally conductive silicone potting compounds can provide encapsulation, electrical insulation and thermal conduction in suitable OBC assemblies. Effective heat dissipation depends on material properties, potting geometry and the overall thermal design.
Key Functions
- Encapsulation of selected electronic assemblies
- Electrical insulation and component protection
- Heat transfer through suitable potting structures
- Mechanical support for selected components
Potting design should account for material viscosity, filling geometry, curing conditions, thermal expansion and serviceability.
Thermal Gel for Gap Filling & Heat Transfer
Thermal gels can be used to fill suitable gaps between heat-generating components and cooling structures, improving thermal contact.
Key Functions
- Filling suitable component-to-housing gaps
- Improving thermal contact
- Accommodating selected interface tolerances
- Supporting heat transfer toward cooling surfaces
Material selection should consider gap dimensions, rheological properties, curing behavior where applicable, and long-term reliability.
Thermal Silicone Pads for Component-to-Housing Interfaces
Thermal silicone pads provide a compressible thermal interface for suitable gaps between electronic components and heat-dissipating structures.
Key Functions
- Heat transfer across defined interface gaps
- Accommodation of selected assembly tolerances
- Electrical insulation when specified
- Thermal contact between components and housings
Appropriate pad thickness and compression should be determined based on interface geometry, component stress limits and thermal performance requirements.
Additional Adhesive & Thermal Interface Options
Other material categories may also be considered according to OBC assembly requirements.
One-Component RTV Silicone Adhesive
One-component RTV silicone adhesives may be used for selected component fixing, reinforcement and sealing applications.
Bonding strength, substrate compatibility, curing conditions and environmental requirements should be evaluated.
Thermal Grease
Thermal grease may be suitable for thin, closely fitted thermal interfaces between electronic devices and heat-dissipating structures.
Long-term reliability should be evaluated under relevant thermal cycling, vibration and operating conditions.
OPUTE Material Solutions for On-Board Chargers
The following table provides a general material selection reference for OBC applications.
| Application Area | Material Function | Material Category |
|---|---|---|
| Selected Electronic Cavities | Encapsulation / Insulation / Heat Transfer | Thermally Conductive Silicone Potting Compound |
| Component-to-Housing Thermal Gaps | Gap Filling / Heat Transfer | Thermal Gel |
| Defined Thermal Contact Gaps | Thermal Interface / Insulation | Thermal Silicone Pad |
| Selected PCB Components | Fixing / Mechanical Reinforcement | One-Component RTV Silicone Adhesive |
| Thin Thermal Contact Interfaces | Reduction of Contact Thermal Resistance | Thermal Grease |
Note: Final material selection depends on OBC design, component compatibility, electrical requirements, thermal conditions and validation testing.
Find the Right Material for Your OBC Application
OPUTE provides industrial silicone adhesives and thermal management material solutions for power electronic assemblies.
Our material categories include thermally conductive silicone potting compounds, thermal gels, thermal pads, thermal greases and one-component silicone adhesives.
Share your application drawings, interface dimensions, operating temperatures and performance requirements with our team to discuss suitable material options.
Looking for OBC Adhesive & Thermal Management Solutions?
Contact OPUTE to discuss potting, bonding, electronic protection and thermal interface requirements for your on-board charger project.
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