OPUTE 3 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
OPUTE 3 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
TC-30 Thermal Putty
OPUTE TC-30 is a conformable thermal gap filling material designed for heat transfer between electronic components and heat sinks. With a thermal conductivity of 3.0 ± 0.3 W/m·K, it provides close contact under low compression pressure and supports dispensing-based gap filling applications. Its moldable consistency helps fill uneven interfaces while maintaining shape stability after application.
Key Features & Benefits
- Efficient Heat Transfer: Thermal conductivity of 3.0 ± 0.3 W/m·K for electronic thermal interfaces.
- Low Compression Force: Conforms closely to electronic components under relatively low assembly pressure.
- Excellent Conformability: Fills uneven surfaces and irregular thermal interface gaps.
- Dispensable & Shape-Stable: Designed for dispensing applications while maintaining its applied shape.
- Low Volatility: ≤0.07% after 24 hours at 150°C.
- Low Oil Separation: ≤1% after 24 hours at 150°C.
- Electrical Insulation: Volume resistivity ≥3.2 × 10⁸ Ω·cm.
- Flammability Performance: V0 rating stated in the technical data sheet.
Applications
TC-30 is designed for thermal gap filling between heat-generating electronic components and heat sinks, particularly in compact electronic assemblies and dispensing processes.
- Mobile phone ICs and heat sinks
- Heat-generating electronic components
- Electronic modules and cooling structures
- Dispensed thermal gap filling applications
- Uneven surfaces requiring low compression force
Application suitability and thermal performance should be verified under actual assembly conditions.
Technical Specifications
| Property | TC-30 | Test Method |
|---|---|---|
| Product Type | Thermal Putty / Thermal Gap Filler | — |
| Appearance | White Putty | Visual |
| Thermal Conductivity | 3.0 ± 0.3 W/m·K | ASTM D5470 |
| Thermal Resistance (@20 psi) | 0.05 °C·in²/W | ASTM D5470 |
| Oil Separation (150°C × 24h) | ≤1% | ASTM G120-1 |
| Volatile Content (150°C × 24h) | ≤0.07% | ASTM E595-2006 |
| Volume Resistivity | ≥3.2 × 10⁸ Ω·cm | ASTM D257 |
| Extrusion Rate (90 psi) | 15 g/min | — |
| Flammability Rating | V0 (as stated in TDS) | Flammability Tester |
| Operating Temperature | Please contact OPUTE for confirmation | — |
Packaging & Storage
- Standard Packaging: 50 ml, 100 ml and 300 ml cartridges.
- Custom Packaging: Other packaging sizes subject to customer requirements and confirmation.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: 1 year under specified storage conditions.
- Transportation: Non-dangerous goods; transported as general chemicals.
Application & Handling Guidelines
- Ensure the application surfaces are clean and dry before dispensing.
- Dispense the material into the required thermal interface gap.
- Confirm dispensing settings and assembly pressure under actual production conditions.
- Perform application-specific thermal testing before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE for TC-30 technical specifications, packaging options, samples and thermal gap filling recommendations. Share your gap dimensions, dispensing process and thermal requirements with our team.
Request a QuoteTechnical information is based on OPUTE TC-30 Technical Data Sheet, revision A/0, dated December 3, 2024. Product suitability should be confirmed through application-specific testing.