OPUTE Nano-Carbon Coated Copper Foil for Thermal Management – High Performance Heat Spreading Film
OPUTE Nano-Carbon Coated Copper Foil for Thermal Management – High Performance Heat Spreading Film
OPUTE Nano-Carbon Coated Copper Foil
High-Conductivity Copper Heat Spreader | Custom Die-Cut Foil
A thin copper foil substrate combined with a nano-carbon surface coating supports lateral heat spreading and high-emissivity surface performance. Optional adhesive backing allows integration into compact electronic assemblies.
Key Features & Benefits
- Designed for lateral heat spreading in thin electronic assemblies
- Flexible integration into space-constrained product designs
- Available in multiple grades and constructions
- Custom die-cutting and size options for production assembly
Typical Applications
- Smartphones and handheld electronics
- Laptops and tablets
- LED lighting assemblies
- Heat spreading in compact electronics
Technical Specifications
| Grade | DC38-45 | DC38-65 | DC66-95 | DC66-115 |
|---|---|---|---|---|
| Thickness | 0.045 ± 0.01 mm | 0.065 ± 0.01 mm | 0.095 ± 0.01 mm | 0.115 ± 0.01 mm |
| Reported thermal conductivity | ≥680 W/m·K | ≥700 W/m·K | ≥730 W/m·K | ≥780 W/m·K |
| Thermal diffusivity | ≥130 mm²/s | ≥140 mm²/s | ≥150 mm²/s | ≥170 mm²/s |
| Surface emissivity | 0.95 | 0.95 | 0.95 | 0.95 |
| Heat deformation temperature | 200°C | 200°C | 200°C | 200°C |
| Tensile strength | ≥295 MPa | ≥335 MPa | ≥375 MPa | ≥385 MPa |
| Coating adhesion | ≥4B | ≥4B | ≥4B | ≥4B |
Values are typical or reported supplier data and may vary by grade, laminate construction and test method.
Available Sizes & Customization
OPUTE supports application-specific dimensions, sheets, rolls and precision die-cut parts, subject to material grade and production feasibility. Contact us with your required thickness, dimensions, adhesive configuration and annual demand.
Request a Quote or Sample
Contact OPUTE to discuss material selection, sample availability, custom die-cutting and technical documentation.