OPUTE 8.0 W/m·K High Performance Thermal Phase Change Material for CPUs, Servers & Power Electronics – Custom Sizes
OPUTE 8.0 W/m·K High Performance Thermal Phase Change Material for CPUs, Servers & Power Electronics – Custom Sizes
8.0 W/m·K High Performance Thermal Phase Change Material
OPUTE 8.0 W/m·K Thermal Phase Change Material is a high-performance thermal interface sheet for demanding electronic cooling applications. It remains solid at room temperature for easy cutting and assembly. When the interface reaches its phase change temperature, the material softens to fill microscopic gaps between heat-generating components and heat sinks, supporting efficient heat transfer in high-power-density systems.
Key Features & Benefits
- High thermal conductivity of 8.0 W/m·K
- Low thermal resistance of ≤0.13 K·cm²/W at 50 psi
- Solid sheet format for convenient handling and installation
- Phase change softening enhances surface wetting and contact
- Excellent ability to conform to microscopic interface gaps
- Designed to avoid silicone oil pump-out issues
- Suitable for high-power-density electronic cooling
- Custom sheet dimensions and die-cut shapes available
Typical Applications
- High-performance CPUs and overclocking processors
- High-power-density integrated circuits
- Server and computing electronics
- Aerospace electronic thermal management
- Automotive electronic systems
- Communication and base station equipment
- Interfaces between semiconductors and heat sinks
Technical Specifications
Typical physical properties of the 8.0 W/m·K grade.
| Property | Typical Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Thermal Conductivity | 8.0 W/m·K | ASTM D5470 |
| Thickness | 0.13–0.5 mm | ASTM D374 |
| Density | 2.8 g/cm³ | ASTM D792 |
| Thermal Resistance @50 psi | ≤0.13 K·cm²/W | ASTM D5470 |
| Operating Temperature | -40°C to +125°C | — |
| Phase Change Temperature | 50±5°C | — |
Available Sizes & Customization
- Standard Sheet Size: 200 × 400 mm
- Thickness Range: 0.13–0.5 mm
- Customization: Custom dimensions and precision die-cut shapes available upon request.
Looking for a High Performance Phase Change Material?
OPUTE offers thermal phase change material solutions for processors, servers and power electronics. Contact us for customized specifications, samples and quotation support.
Request a QuoteNote: Typical values are provided for reference. Actual thermal performance depends on surface roughness, flatness and applied pressure. Confirm final specifications before application approval.