OPUTE 5.0 W/m·K High Performance Thermal Phase Change Material Pad for CPUs, IGBTs & Servers – Custom Sizes
OPUTE 5.0 W/m·K High Performance Thermal Phase Change Material Pad for CPUs, IGBTs & Servers – Custom Sizes
5.0 W/m·K High Performance Thermal Phase Change Material
OPUTE 5.0 W/m·K Thermal Phase Change Material is a high-performance thermal interface sheet designed for processors, IGBTs, servers and other heat-generating electronic components. The material remains solid at room temperature for convenient cutting, handling and installation. When the interface reaches its phase change temperature, it softens and conforms to microscopic surface irregularities, helping reduce thermal contact resistance between electronic components and heat sinks.
Key Features & Benefits
- High Thermal Conductivity: 5.0 W/m·K for demanding electronic cooling applications.
- Phase Change Technology: Softens at approximately 50°C to improve contact with uneven surfaces.
- Low Thermal Resistance: ≤0.15 K·cm²/W at 50 psi under the specified test conditions.
- Excellent Surface Wetting: Conforms to microscopic irregularities between heat sources and heat sinks.
- Easy Installation: Solid sheet format at room temperature for convenient handling and die-cutting.
- Temperature Resistance: Operating temperature range from -40°C to +125°C.
- Designed to Avoid Silicone Oil Pump-Out: Supports long-term thermal interface stability.
- Custom Processing: Custom sheet dimensions and die-cut shapes available.
Typical Applications
- High-performance CPUs and processors
- IGBT power modules and semiconductor devices
- Servers and computing equipment
- Automotive electronic systems
- Communication equipment and base stations
- Data storage devices
- Thermal interfaces between heat-generating components and heat sinks
Technical Specifications
Typical physical properties of the 5.0 W/m·K grade.
| Property | Typical Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Thermal Conductivity | 5.0 W/m·K | ASTM D5470 |
| Thickness | 0.13–0.5 mm | ASTM D374 |
| Density | 2.6 g/cm³ | ASTM D792 |
| Thermal Resistance @50 psi | ≤0.15 K·cm²/W | ASTM D5470 |
| Operating Temperature | -40°C to +125°C | — |
| Phase Change Temperature | 50±5°C | — |
Available Sizes & Customization
- Standard Sheet Size: 200 × 400 mm
- Thickness Range: 0.13–0.5 mm
- Color: Gray
- Custom Dimensions: Available according to application requirements.
- Die-Cutting: Custom shapes for processors, semiconductor packages and heat sink assemblies.
Looking for a Customized Thermal Phase Change Material?
OPUTE provides thermal phase change material solutions for processors, IGBTs, servers and power electronics. Contact us for custom sizes, technical specifications, samples and quotation support.
Request a QuoteNote: Technical values are typical reference data. Actual thermal performance depends on surface roughness, flatness and applied pressure. Final specifications should be confirmed before application approval.