OPUTE 5 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
OPUTE 5 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
TC-50 Thermal Putty
OPUTE TC-50 is a highly conformable thermal gap filling material designed to improve heat transfer between electronic components and heat sinks. With a thermal conductivity of 5.0 ± 0.3 W/m·K, it provides close thermal contact under low compression pressure and can be applied through dispensing processes. Its moldable consistency helps fill irregular gaps while maintaining shape stability after application.
Key Features & Benefits
- Efficient Heat Transfer: Thermal conductivity of 5.0 ± 0.3 W/m·K for electronic gap filling.
- Low Compression Force: Conforms to heat-generating components under relatively low assembly pressure.
- Excellent Conformability: Helps fill uneven surfaces and irregular thermal interface gaps.
- Dispensable & Shape-Stable: Supports dispensing-based application while maintaining its applied shape.
- Low Volatility: ≤0.07% after 24 hours at 150°C.
- Oil Separation: ≤2% after 24 hours at 150°C.
- Electrical Insulation: Volume resistivity ≥3.2 × 10⁸ Ω·cm and breakdown strength ≥3.0 kV/mm.
- Metal Surface Compatibility: The TDS states that the material does not cause metal surface corrosion.
Applications
TC-50 is intended for thermal gap filling between heat-generating electronic components and heat sinks, particularly in compact electronic assemblies and automated dispensing processes.
- Mobile phone ICs and heat sinks
- Heat-generating electronic components
- Compact electronic assemblies
- Automated dispensing and thermal gap filling
- Uneven interfaces requiring low compression force
Application suitability and thermal performance should be verified under actual assembly conditions.
Technical Specifications
| Property | TC-50 | Test Method |
|---|---|---|
| Product Type | Thermal Putty / Thermal Gap Filler | — |
| Appearance | White Putty | Visual |
| Thermal Conductivity | 5.0 ± 0.3 W/m·K | GB/T 5598-1985 |
| Oil Separation (150°C × 24h) | ≤2% | SH/T 0324-1992 |
| Volatile Content (150°C × 24h) | ≤0.07% | SH/T 0337-92 |
| Volume Resistivity | ≥3.2 × 10⁸ Ω·cm | GB/T 1692-2008 |
| Breakdown Strength | ≥3.0 kV/mm | GB/T 1695-2005 |
Packaging & Storage
- Packaging: Please contact OPUTE to confirm available packaging sizes.
- Custom Packaging: Packaging options can be discussed based on customer requirements.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: 1 year under specified storage conditions.
- Transportation: Non-dangerous goods; transported as general chemicals.
Application & Handling Guidelines
- Ensure application surfaces are clean and dry before dispensing.
- Apply thermal putty to the required thermal interface gap.
- Reseal unused material before returning it to storage.
- Verify thermal performance and material compatibility before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE for TC-50 technical specifications, available packaging, samples and application recommendations. Share your gap dimensions, assembly pressure and thermal requirements with our team.
Request a QuoteTechnical information is based on OPUTE TC-50 Technical Data Sheet, revision A/0, dated December 3, 2022. Product suitability should be confirmed through application-specific testing.