OPUTE 4.0 W/m·K Silicone Thermal Gel – High Performance Gap Filler for IGBT & Power Modules
OPUTE 4.0 W/m·K Silicone Thermal Gel – High Performance Gap Filler for IGBT & Power Modules
TF-40 Two-Component Thermal Gel
OPUTE TF-40 is a soft, ceramic-filled silicone resin-based, two-component thermal gap-filling material with a thermal conductivity of 4.0 W/m·K. Designed for relatively large or uneven interface gaps, it provides low interfacial thermal resistance, good thixotropic properties and excellent conformability. Applied between heat-generating electronic components and heat sinks or housings, TF-40 helps improve thermal contact and heat transfer. It can be applied manually or with dispensing equipment.
Key Features & Benefits
- Efficient Heat Transfer: 4.0 W/m·K thermal conductivity supports heat transfer between electronic components and cooling surfaces.
- Low Interfacial Thermal Resistance: Designed to improve thermal contact between mating surfaces.
- Low Compression Force: Soft and conformable material fits closely against components under relatively low pressure.
- Good Thixotropic Properties: Supports dispensing and shape retention after application.
- Operating Temperature Range: Specified for use from -50°C to 160°C.
- Removable After Curing: The cured material can be peeled off for removal.
Applications
TF-40 is designed for thermal gap filling between heat sources and heat sinks or housings. The TDS specifically identifies mobile phone ICs and heat sinks as an application. Potential uses include:
- Mobile phone ICs and heat sinks
- Electronic components and cooling structures
- Power electronics and electronic modules
- Assemblies with relatively large or uneven thermal interface gaps
- Manual or automated dispensing applications
Application suitability should be verified through testing under actual assembly and operating conditions.
Technical Specifications
| Property | TF-40 | Test Method |
|---|---|---|
| Material Composition | Ceramic-filled Silicone Resin | — |
| Component System | Two-Component (A+B) | — |
| Color Before Mixing | A: Green / B: White | Visual |
| Color After Mixing | Light Green | Visual |
| Specific Gravity | A: 3.3 / B: 3.3 g/cm³ | ASTM D792 |
| Viscosity Before Mixing | A: 480,000 / B: 470,000 mPa·s | ASTM D2196 |
| Mixing Ratio (A:B) | 1:1 | — |
| Thermal Conductivity | 4.0 W/m·K | ASTM D5470 |
| Thermal Resistance (@40 mil, 20 psi) | 0.3 °C·in²/W | ASTM D5470 |
| Hardness | 35–60 Shore 00 | ASTM D2240 |
| Volume Resistivity | 2.0 × 10¹² Ω·cm | ASTM D257 |
| Dielectric Breakdown Strength | >200 VAC/mil | ASTM D149 |
| Dielectric Constant (@1 MHz) | 5 | ASTM D150 |
| Operating Temperature | -50°C to 160°C | — |
| Flammability Rating | 94 V-0 (TDS stated) | GB/T 10707-2008 |
Mixing & Curing
TF-40 consists of two components mixed at an A:B ratio of 1:1. The following conditions are specified in the technical data sheet:
- 25°C: 2 hours (surface drying time)
- 100°C: 20 minutes (TDS curing condition)
Packaging & Storage
- Packaging Options: Please contact OPUTE to confirm available standard packaging sizes.
- Custom Packaging: Available upon request, subject to confirmation.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: Please confirm with OPUTE before ordering.
- Transportation: Classified as non-dangerous goods according to the TDS.
Application & Handling Guidelines
- Ensure application surfaces are clean and dry.
- Mix components A and B at the specified 1:1 ratio.
- Apply the mixed material manually or using suitable dispensing equipment.
- Follow the processing and curing conditions stated in the TDS.
- Reseal unused material before storage.
- Conduct application-specific testing before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE to discuss TF-40 thermal gel, thermal conductivity requirements, interface gap dimensions, dispensing processes and packaging options. Our team can help evaluate suitable thermal interface materials for your electronic assembly.
Request a QuoteTechnical information is based on OPUTE TF-40 Technical Data Sheet, revision A/2, dated April 17, 2026. Customers should verify application suitability through testing under actual operating conditions.