OPUTE 3.0 W/m·K Thermal Phase Change Material Pad for Power Electronics & Heat Sinks – Custom Die Cutting
OPUTE 3.0 W/m·K Thermal Phase Change Material Pad for Power Electronics & Heat Sinks – Custom Die Cutting
3.0 W/m·K Thermal Phase Change Material
OPUTE 3.0 W/m·K Thermal Phase Change Material is a cost-effective thermal interface sheet for integrated circuits, power devices and electronic cooling assemblies. Solid at room temperature, it is easy to cut and install. When heated to its phase change temperature, the material softens and conforms to microscopic gaps between heat-generating components and heat sinks, improving thermal contact.
Key Features & Benefits
- Thermal conductivity of 3.0 W/m·K
- Solid sheet format for convenient cutting and installation
- Phase change softening improves contact with uneven surfaces
- Excellent surface wetting and gap-filling properties
- Good temperature resistance for electronic applications
- Designed to avoid silicone oil pump-out issues
- Balanced thermal performance and cost efficiency
- Custom dimensions and die-cut shapes available
Typical Applications
- Automotive electronics
- Communication equipment
- Data storage devices
- Routers and base station equipment
- Power semiconductor thermal interfaces
- Heat-generating integrated circuits and heat sinks
Technical Specifications
Typical physical properties of the 3.0 W/m·K grade.
| Property | Typical Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Thermal Conductivity | 3.0 W/m·K | ASTM D5470 |
| Thickness | 0.13–0.5 mm | ASTM D374 |
| Density | 2.9 g/cm³ | ASTM D792 |
| Thermal Resistance @50 psi | ≤0.30 K·cm²/W | ASTM D5470 |
| Operating Temperature | -40°C to +125°C | — |
| Phase Change Temperature | 50±5°C | — |
Available Sizes & Customization
- Standard Sheet Size: 200 × 400 mm
- Thickness Range: 0.13–0.5 mm
- Customization: Custom sheet dimensions and precision die-cut shapes available upon request.
Looking for a Customized Phase Change Material?
OPUTE provides thermal phase change sheets for power electronics and electronic cooling applications. Contact us for samples, technical specifications and quotations.
Request a QuoteNote: Typical values are provided for reference. Actual thermal performance depends on contact surface roughness, flatness and applied pressure. Confirm final specifications before use.