OPUTE 3.0 W/m·K Thermally Conductive Gel – Dispensable Gap Filler for EV Battery & BMS
OPUTE 3.0 W/m·K Thermally Conductive Gel – Dispensable Gap Filler for EV Battery & BMS
TF-30 Two-Component Thermal Gel
OPUTE TF-30 is a soft, ceramic-filled silicone resin-based, two-component thermal gap-filling material with a thermal conductivity of 3.0 W/m·K. Designed for relatively large or uneven interface gaps, it offers low interfacial thermal resistance, good thixotropic properties and excellent conformability. Applied between heat-generating electronic components and heat sinks or housings, TF-30 helps improve thermal contact and heat transfer. It can be applied manually or with dispensing equipment.
Key Features & Benefits
- Efficient Heat Transfer: 3.0 W/m·K thermal conductivity helps transfer heat between electronic components and cooling surfaces.
- Low Interfacial Thermal Resistance: Designed to improve thermal contact between mating surfaces.
- Low Compression Force: Soft and conformable material fits closely against components under relatively low pressure.
- Good Thixotropic Properties: Supports dispensing and shape retention after application.
- Wide Operating Temperature Range: Specified for use from -50°C to 200°C.
- Removable After Curing: The cured material can be peeled off for removal.
Applications
TF-30 is designed for thermal gap filling between heat sources and heat sinks or housings. The TDS specifically identifies mobile phone ICs and heat sinks as an application. Potential uses include:
- Mobile phone ICs and heat sinks
- Electronic components and cooling structures
- Power electronics and electronic modules
- Assemblies with relatively large or uneven thermal interface gaps
- Manual or automated dispensing applications
Application suitability should be verified through testing under actual assembly and operating conditions.
Technical Specifications
| Property | TF-30 | Test Method |
|---|---|---|
| Material Composition | Ceramic-filled Silicone Resin | — |
| Component System | Two-Component (A+B) | — |
| Color Before Mixing | A: Yellow / B: White | Visual |
| Color After Mixing | Yellow | Visual |
| Specific Gravity | A: 3.1 / B: 3.1 g/cm³ | ASTM D792 |
| Viscosity Before Mixing | A: 350,000 / B: 350,000 mPa·s | ASTM D2196 |
| Mixing Ratio (A:B) | 1:1 | — |
| Thermal Conductivity | 3.0 W/m·K | ASTM D5470 |
| Thermal Resistance (@0.5 mm, 20 psi) | 0.35 °C·in²/W | ASTM D5470 |
| Hardness | 35–60 Shore 00 | ASTM D2240 |
| Volume Resistivity | 2.0 × 10¹² Ω·cm | ASTM D257 |
| Dielectric Breakdown Strength | >200 VAC/mil | ASTM D149 |
| Dielectric Constant (@1 MHz) | 5 | ASTM D150 |
| Operating Temperature | -50°C to 200°C | — |
| Flammability Rating | 94 V-0 (TDS stated) | GB/T 10707-2008 |
Mixing & Curing
TF-30 consists of two components that should be mixed at an A:B ratio of 1:1. The following curing conditions are specified in the technical data sheet:
- 25°C: 2 hours
- 100°C: 20 minutes
Packaging & Storage
- Standard Packaging: 50 ml, 100 ml and 300 ml cartridges.
- Custom Packaging: Available upon request, subject to confirmation.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: Please confirm with OPUTE before ordering.
- Transportation: Classified as non-dangerous goods according to the TDS.
Application & Handling Guidelines
- Ensure application surfaces are clean and dry.
- Mix components A and B at the specified 1:1 ratio.
- Apply the mixed material manually or using suitable dispensing equipment.
- Follow the specified curing conditions.
- Reseal unused material before storage.
- Conduct application-specific testing before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE to discuss TF-30 thermal gel, thermal conductivity requirements, interface gap dimensions, dispensing processes and packaging options. Our team can help evaluate suitable thermal interface materials for your electronic assembly.
Request a QuoteTechnical information is based on OPUTE TF-30 Technical Data Sheet, revision A/2, dated March 21, 2026. Customers should verify application suitability through testing under actual operating conditions.