OPUTE 2.0 W/m·K Thermal Gel – Soft Silicone Gap Filler for Power Supplies & Electronics Cooling
OPUTE 2.0 W/m·K Thermal Gel – Soft Silicone Gap Filler for Power Supplies & Electronics Cooling
TF-20 Two-Component Thermal Gel
OPUTE TF-20 is a soft, silicone resin-based, two-component thermal gap-filling material with a thermal conductivity of 2.0 W/m·K. Filled with ceramic particles, it offers good thixotropic properties and conformability for electronic assemblies with relatively large or uneven gaps. Applied between heat-generating components and heat sinks or housings, TF-20 helps reduce thermal resistance and improve heat transfer. It can be applied manually or with dispensing equipment.
Key Features & Benefits
- Efficient Heat Transfer: 2.0 W/m·K thermal conductivity helps transfer heat between electronic components and cooling surfaces.
- Low Compression Force: Soft and conformable material makes close contact with heat-generating components under relatively low pressure.
- Good Thixotropic Properties: Supports dispensing and shape retention during application.
- Gap Filling Performance: Suitable for evaluation in relatively large or uneven interface gaps.
- Wide Operating Temperature Range: Specified for use from -50°C to 200°C.
- Removable After Curing: The cured material can be peeled off for removal.
Applications
TF-20 is designed to fill thermal interface gaps between heat sources and heat sinks or housings. Potential applications include:
- Electronic components and heat sinks
- Power electronics and control modules
- Electronic assemblies with large or uneven interface gaps
- Thermal interfaces between electronic modules and housings
- Manual or automated dispensing applications
Application suitability should be verified through testing under actual assembly and operating conditions.
Technical Specifications
| Property | TF-20 | Test Method |
|---|---|---|
| Material Composition | Ceramic-filled Silicone Resin | — |
| Component System | Two-Component (A+B) | — |
| Color Before Mixing | A: Yellow / B: White | Visual |
| Color After Mixing | Yellow | Visual |
| Specific Gravity | A: 2.1 / B: 2.1 g/cm³ | ASTM D792 |
| Viscosity Before Mixing | A: 350,000 / B: 350,000 mPa·s | ASTM D2196 |
| Mixing Ratio (A:B) | 1:1 | — |
| Thermal Conductivity | 2.0 W/m·K | ASTM D5470 |
| Thermal Resistance (@0.5 mm, 20 psi) | 1.15 °C·cm²/W | ASTM D5470 |
| Hardness | 35–60 Shore 00 | ASTM D2240 |
| Volume Resistivity | 2.0 × 10¹² Ω·cm | ASTM D257 |
| Dielectric Breakdown Strength | >200 VAC/mil | ASTM D149 |
| Dielectric Constant (@1 MHz) | 5 | ASTM D150 |
| Operating Temperature | -50°C to 200°C | — |
| Flammability Rating | 94 V-0 (TDS stated) | GB/T 10707-2008 |
Mixing & Curing
TF-20 consists of two components that should be mixed at an A:B ratio of 1:1. The following curing conditions are specified in the technical data sheet:
- 25°C: 2 hours
- 100°C: 10 minutes
Packaging & Storage
- Standard Packaging: 50 ml, 100 ml and 300 ml cartridges.
- Custom Packaging: Available upon request, subject to confirmation.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: 1 year under the specified storage conditions.
- Transportation: Classified as non-dangerous goods according to the TDS.
Application & Handling Guidelines
- Ensure the application surfaces are clean and dry.
- Mix components A and B at the specified 1:1 ratio.
- Apply the mixed material manually or using suitable dispensing equipment.
- Follow the specified curing conditions.
- Reseal any unused material before storage.
- Conduct application-specific testing before mass production.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE to discuss TF-20 thermal gel, thermal conductivity requirements, interface gap dimensions, dispensing processes and packaging options. Our team can help evaluate suitable thermal interface materials for your electronic assembly.
Request a QuoteTechnical information is based on OPUTE TF-20 Technical Data Sheet, revision A/0, dated February 15, 2026. Customers should verify application suitability through testing under actual operating conditions.