OPUTE 2 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
OPUTE 2 W/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation
TC-20 Silicone Thermal Putty
OPUTE TC-20 is a single-component, thixotropic silicone-based thermal putty formulated with metal oxides and silicone resin. With a thermal conductivity of 2.0 W/m·K, it is designed to fill gaps and uneven interfaces between heat-generating electronic components and heat sinks. The material remains soft over time and provides electrical insulation, water resistance, low oil separation and low volatility.
Key Features & Benefits
- Thermal Gap Filling: Helps replace air gaps between heat sources and heat sinks for improved thermal contact.
- Single-Component Formula: Ready for application without mixing A and B components.
- Soft & Thixotropic: Conforms to irregular surfaces and remains soft over time.
- Low Oil Separation: ≤0.7% after 24 hours at 150°C.
- Low Volatility: ≤0.15% after 24 hours at 150°C.
- Electrical Insulation: Volume resistivity ≥1.0 × 10⁸ Ω·cm.
- Extrusion Performance: Extrusion rate of 11 g/min under 90 psi test pressure.
- Water Resistance: Silicone-based formulation with water-resistant properties.
Applications
TC-20 is designed for thermal gap filling between heat-generating electronic components and heat sinks, particularly where mating surfaces are uneven or irregular.
- Integrated circuits (ICs)
- Transistors and electronic power components
- Processors and electronic assemblies
- Heat sources and heat sinks
- Uneven electronic thermal interfaces
Application suitability and thermal performance should be verified under actual assembly conditions.
Technical Specifications
| Property | TC-20 | Test Method |
|---|---|---|
| Product Type | Single-Component Silicone Thermal Putty | — |
| Appearance | White / Light Blue Putty | Visual |
| Thermal Conductivity | 2.0 W/m·K | ASTM D5470 |
| Thermal Resistance | 0.18 °C·cm²/W | ASTM D5470 |
| Oil Separation (150°C × 24h) | ≤0.7% | SH/T 0324-1992 |
| Volatile Content (150°C × 24h) | ≤0.15% | SH/T 0337-92 |
| Volume Resistivity | ≥1.0 × 10⁸ Ω·cm | GB/T 1692-2008 |
| Operating Temperature | -40°C to 160°C | — |
| Extrusion Rate (90 psi) | 11 g/min | — |
| Material Composition | Metal Oxides & Silicone Resin | — |
Packaging & Storage
- Standard Packaging: 30 ml, 50 ml and 300 ml cartridges.
- Custom Packaging: Other packaging sizes available subject to confirmation.
- Storage: Store sealed in a cool, dry environment.
- Shelf Life: 1 year under specified storage conditions.
- Transportation: Non-dangerous goods; transported as general chemicals.
Application & Handling Guidelines
- Ensure contact surfaces are clean and dry before application.
- Apply an appropriate amount of thermal putty to the target gap.
- Reseal unused material before returning it to storage.
- Conduct application-specific testing before production use.
Looking for a Thermal Gap Filling Solution?
Contact OPUTE for TC-20 technical specifications, available packaging, samples and application recommendations. Share your gap dimensions, operating temperature and thermal requirements with our team.
Request a QuoteTechnical information is based on OPUTE TC-20 Technical Data Sheet, revision A/0, dated July 22, 2025. Product suitability should be confirmed through application-specific testing.