{"product_id":"opute-4-0-w-m-k-silicone-thermal-gel-high-performance-gap-filler-for-igbt-power-modules","title":"OPUTE 4.0 W\/m·K Silicone Thermal Gel – High Performance Gap Filler for IGBT \u0026 Power Modules","description":"\n\u003cdiv style=\"font-family:Arial,Helvetica,sans-serif;color:#263746;line-height:1.7;font-size:15px;max-width:1200px;margin:auto;\"\u003e\n\n  \u003c!-- PRODUCT OVERVIEW --\u003e\n  \u003cdiv style=\"border-bottom:2px solid #0879bb;padding-bottom:15px;margin-bottom:25px;\"\u003e\n    \u003ch2 style=\"font-size:27px;color:#086da9;margin:0 0 12px;\"\u003e\n      TF-40 Two-Component Thermal Gel\n    \u003c\/h2\u003e\n    \u003cp style=\"margin:0;\"\u003e\n      OPUTE TF-40 is a soft, ceramic-filled silicone\n      resin-based, two-component thermal gap-filling\n      material with a thermal conductivity of\n      4.0 W\/m·K. Designed for relatively large\n      or uneven interface gaps, it provides low\n      interfacial thermal resistance, good thixotropic\n      properties and excellent conformability.\n      Applied between heat-generating electronic\n      components and heat sinks or housings,\n      TF-40 helps improve thermal contact and\n      heat transfer. It can be applied manually\n      or with dispensing equipment.\n    \u003c\/p\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- KEY SPECIFICATIONS --\u003e\n  \u003cdiv style=\"display:flex;flex-wrap:wrap;gap:12px;margin-bottom:30px;\"\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e4.0\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eThermal Conductivity (W\/m·K)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e1:1\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eMixing Ratio (A:B)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:20px;font-weight:bold;color:#0879bb;\"\u003e-50~160°C\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eOperating Temperature\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e94 V-0\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eFlammability Rating (TDS)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n  \u003c\/div\u003e\n\n  \u003c!-- FEATURES --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Key Features \u0026amp; Benefits\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003eEfficient Heat Transfer:\u003c\/strong\u003e 4.0 W\/m·K thermal conductivity supports heat transfer between electronic components and cooling surfaces.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Interfacial Thermal Resistance:\u003c\/strong\u003e Designed to improve thermal contact between mating surfaces.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Compression Force:\u003c\/strong\u003e Soft and conformable material fits closely against components under relatively low pressure.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eGood Thixotropic Properties:\u003c\/strong\u003e Supports dispensing and shape retention after application.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eOperating Temperature Range:\u003c\/strong\u003e Specified for use from -50°C to 160°C.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eRemovable After Curing:\u003c\/strong\u003e The cured material can be peeled off for removal.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- APPLICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Applications\n  \u003c\/h3\u003e\n\n  \u003cp\u003e\n    TF-40 is designed for thermal gap filling between\n    heat sources and heat sinks or housings. The TDS\n    specifically identifies mobile phone ICs and\n    heat sinks as an application. Potential uses include:\n  \u003c\/p\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eMobile phone ICs and heat sinks\u003c\/li\u003e\n    \u003cli\u003eElectronic components and cooling structures\u003c\/li\u003e\n    \u003cli\u003ePower electronics and electronic modules\u003c\/li\u003e\n    \u003cli\u003eAssemblies with relatively large or uneven thermal interface gaps\u003c\/li\u003e\n    \u003cli\u003eManual or automated dispensing applications\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003cp style=\"font-size:13px;color:#657482;margin-bottom:28px;\"\u003e\n    Application suitability should be verified\n    through testing under actual assembly\n    and operating conditions.\n  \u003c\/p\u003e\n\n  \u003c!-- TECHNICAL SPECIFICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Technical Specifications\n  \u003c\/h3\u003e\n\n  \u003cdiv style=\"width:100%;overflow-x:auto;margin-bottom:30px;\"\u003e\n    \u003ctable style=\"border-collapse:collapse;width:100%;font-size:13px;\"\u003e\n      \u003cthead\u003e\n        \u003ctr style=\"background:#0879bb;color:#ffffff;\"\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eProperty\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTF-40\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTest Method\u003c\/th\u003e\n        \u003c\/tr\u003e\n      \u003c\/thead\u003e\n\n      \u003ctbody\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eMaterial Composition\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eCeramic-filled Silicone Resin\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eComponent System\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eTwo-Component (A+B)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eColor Before Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eA: Green \/ B: White\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVisual\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eColor After Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eLight Green\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVisual\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eSpecific Gravity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eA: 3.3 \/ B: 3.3 g\/cm³\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D792\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eViscosity Before Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eA: 480,000 \/ B: 470,000 mPa·s\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D2196\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eMixing Ratio (A:B)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e1:1\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Conductivity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e\u003cstrong\u003e4.0 W\/m·K\u003c\/strong\u003e\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Resistance (@40 mil, 20 psi)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e0.3 °C·in²\/W\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eHardness\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e35–60 Shore 00\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D2240\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVolume Resistivity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e2.0 × 10¹² Ω·cm\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D257\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eDielectric Breakdown Strength\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e\u0026gt;200 VAC\/mil\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D149\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eDielectric Constant (@1 MHz)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e5\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D150\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eOperating Temperature\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e-50°C to 160°C\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eFlammability Rating\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e94 V-0 (TDS stated)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eGB\/T 10707-2008\u003c\/td\u003e\n        \u003c\/tr\u003e\n      \u003c\/tbody\u003e\n    \u003c\/table\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- MIXING AND CURING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Mixing \u0026amp; Curing\n  \u003c\/h3\u003e\n\n  \u003cp\u003e\n    TF-40 consists of two components mixed at\n    an A:B ratio of 1:1. The following conditions\n    are specified in the technical data sheet:\n  \u003c\/p\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003e25°C:\u003c\/strong\u003e 2 hours (surface drying time)\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003e100°C:\u003c\/strong\u003e 20 minutes (TDS curing condition)\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- PACKAGING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Packaging \u0026amp; Storage\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003ePackaging Options:\u003c\/strong\u003e Please contact OPUTE to confirm available standard packaging sizes.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eCustom Packaging:\u003c\/strong\u003e Available upon request, subject to confirmation.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eStorage:\u003c\/strong\u003e Store sealed in a cool, dry environment.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eShelf Life:\u003c\/strong\u003e Please confirm with OPUTE before ordering.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eTransportation:\u003c\/strong\u003e Classified as non-dangerous goods according to the TDS.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- APPLICATION INSTRUCTIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Application \u0026amp; Handling Guidelines\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eEnsure application surfaces are clean and dry.\u003c\/li\u003e\n    \u003cli\u003eMix components A and B at the specified 1:1 ratio.\u003c\/li\u003e\n    \u003cli\u003eApply the mixed material manually or using suitable dispensing equipment.\u003c\/li\u003e\n    \u003cli\u003eFollow the processing and curing conditions stated in the TDS.\u003c\/li\u003e\n    \u003cli\u003eReseal unused material before storage.\u003c\/li\u003e\n    \u003cli\u003eConduct application-specific testing before mass production.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- CTA --\u003e\n  \u003cdiv style=\"background:#f0f7fb;padding:25px;border-radius:8px;border-left:4px solid #0879bb;\"\u003e\n    \u003ch3 style=\"color:#086da9;margin:0 0 10px;font-size:20px;\"\u003e\n      Looking for a Thermal Gap Filling Solution?\n    \u003c\/h3\u003e\n\n    \u003cp style=\"margin:0 0 15px;\"\u003e\n      Contact OPUTE to discuss TF-40 thermal gel,\n      thermal conductivity requirements,\n      interface gap dimensions, dispensing processes\n      and packaging options. Our team can help\n      evaluate suitable thermal interface materials\n      for your electronic assembly.\n    \u003c\/p\u003e\n\n    \u003ca href=\"mailto:info@evopute.com?subject=TF-40%20Thermal%20Gel%20Inquiry\" style=\"display:inline-block;background:#0879bb;color:#ffffff;padding:11px 23px;text-decoration:none;border-radius:5px;font-weight:bold;\"\u003e\n      Request a Quote\n    \u003c\/a\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- DISCLAIMER --\u003e\n  \u003cp style=\"font-size:12px;color:#7a8791;margin-top:20px;\"\u003e\n    Technical information is based on OPUTE TF-40\n    Technical Data Sheet, revision A\/2,\n    dated April 17, 2026.\n    Customers should verify application suitability\n    through testing under actual operating conditions.\n  \u003c\/p\u003e\n\n\u003c\/div\u003e\n","brand":"OPUTE Global","offers":[{"title":"Default Title","offer_id":60374428320030,"sku":null,"price":0.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1090\/7890\/5118\/files\/OPUTE_4W_Thermal_Gel_01_800_800.png?v=1792650740","url":"https:\/\/www.oputeglobal.com\/products\/opute-4-0-w-m-k-silicone-thermal-gel-high-performance-gap-filler-for-igbt-power-modules","provider":"OPUTE Global","version":"1.0","type":"link"}