{"product_id":"opute-3-w-m-k-thermal-putty-for-electronic-gap-filling-and-heat-dissipation","title":"OPUTE 3 W\/m·K Thermal Putty for Electronic Gap Filling and Heat Dissipation","description":"\n\u003cdiv style=\"font-family:Arial,Helvetica,sans-serif;color:#263746;line-height:1.7;font-size:15px;max-width:1200px;margin:auto;\"\u003e\n\n  \u003c!-- PRODUCT OVERVIEW --\u003e\n  \u003cdiv style=\"border-bottom:2px solid #0879bb;padding-bottom:15px;margin-bottom:25px;\"\u003e\n    \u003ch2 style=\"font-size:27px;color:#086da9;margin:0 0 12px;\"\u003e\n      TC-30 Thermal Putty\n    \u003c\/h2\u003e\n    \u003cp style=\"margin:0;\"\u003e\n      OPUTE TC-30 is a conformable thermal gap\n      filling material designed for heat transfer\n      between electronic components and heat sinks.\n      With a thermal conductivity of 3.0 ± 0.3 W\/m·K,\n      it provides close contact under low compression\n      pressure and supports dispensing-based gap\n      filling applications. Its moldable consistency\n      helps fill uneven interfaces while maintaining\n      shape stability after application.\n    \u003c\/p\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- KEY SPECIFICATIONS --\u003e\n  \u003cdiv style=\"display:flex;flex-wrap:wrap;gap:12px;margin-bottom:30px;\"\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e3.0 ± 0.3\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eThermal Conductivity (W\/m·K)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e≤0.07%\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eVolatile Content (150°C \/ 24h)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e15\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eExtrusion Rate (g\/min at 90 psi)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003eV0\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eFlammability Rating (TDS)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n  \u003c\/div\u003e\n\n  \u003c!-- FEATURES --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Key Features \u0026amp; Benefits\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003eEfficient Heat Transfer:\u003c\/strong\u003e Thermal conductivity of 3.0 ± 0.3 W\/m·K for electronic thermal interfaces.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Compression Force:\u003c\/strong\u003e Conforms closely to electronic components under relatively low assembly pressure.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eExcellent Conformability:\u003c\/strong\u003e Fills uneven surfaces and irregular thermal interface gaps.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eDispensable \u0026amp; Shape-Stable:\u003c\/strong\u003e Designed for dispensing applications while maintaining its applied shape.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Volatility:\u003c\/strong\u003e ≤0.07% after 24 hours at 150°C.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Oil Separation:\u003c\/strong\u003e ≤1% after 24 hours at 150°C.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eElectrical Insulation:\u003c\/strong\u003e Volume resistivity ≥3.2 × 10⁸ Ω·cm.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eFlammability Performance:\u003c\/strong\u003e V0 rating stated in the technical data sheet.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- APPLICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Applications\n  \u003c\/h3\u003e\n\n  \u003cp\u003e\n    TC-30 is designed for thermal gap filling\n    between heat-generating electronic components\n    and heat sinks, particularly in compact\n    electronic assemblies and dispensing processes.\n  \u003c\/p\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eMobile phone ICs and heat sinks\u003c\/li\u003e\n    \u003cli\u003eHeat-generating electronic components\u003c\/li\u003e\n    \u003cli\u003eElectronic modules and cooling structures\u003c\/li\u003e\n    \u003cli\u003eDispensed thermal gap filling applications\u003c\/li\u003e\n    \u003cli\u003eUneven surfaces requiring low compression force\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003cp style=\"font-size:13px;color:#657482;margin-bottom:28px;\"\u003e\n    Application suitability and thermal performance\n    should be verified under actual assembly conditions.\n  \u003c\/p\u003e\n\n  \u003c!-- TECHNICAL SPECIFICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Technical Specifications\n  \u003c\/h3\u003e\n\n  \u003cdiv style=\"width:100%;overflow-x:auto;margin-bottom:30px;\"\u003e\n    \u003ctable style=\"border-collapse:collapse;width:100%;font-size:13px;\"\u003e\n      \u003cthead\u003e\n        \u003ctr style=\"background:#0879bb;color:#ffffff;\"\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eProperty\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTC-30\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTest Method\u003c\/th\u003e\n        \u003c\/tr\u003e\n      \u003c\/thead\u003e\n\n      \u003ctbody\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eProduct Type\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Putty \/ Thermal Gap Filler\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eAppearance\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eWhite Putty\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVisual\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Conductivity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e\u003cstrong\u003e3.0 ± 0.3 W\/m·K\u003c\/strong\u003e\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Resistance (@20 psi)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e0.05 °C·in²\/W\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eOil Separation (150°C × 24h)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e≤1%\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM G120-1\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVolatile Content (150°C × 24h)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e≤0.07%\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM E595-2006\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVolume Resistivity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e≥3.2 × 10⁸ Ω·cm\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D257\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eExtrusion Rate (90 psi)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e15 g\/min\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eFlammability Rating\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eV0 (as stated in TDS)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eFlammability Tester\u003c\/td\u003e\n        \u003c\/tr\u003e\n\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eOperating Temperature\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003ePlease contact OPUTE for confirmation\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n      \u003c\/tbody\u003e\n    \u003c\/table\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- PACKAGING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Packaging \u0026amp; Storage\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003eStandard Packaging:\u003c\/strong\u003e 50 ml, 100 ml and 300 ml cartridges.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eCustom Packaging:\u003c\/strong\u003e Other packaging sizes subject to customer requirements and confirmation.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eStorage:\u003c\/strong\u003e Store sealed in a cool, dry environment.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eShelf Life:\u003c\/strong\u003e 1 year under specified storage conditions.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eTransportation:\u003c\/strong\u003e Non-dangerous goods; transported as general chemicals.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- APPLICATION GUIDELINES --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Application \u0026amp; Handling Guidelines\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eEnsure the application surfaces are clean and dry before dispensing.\u003c\/li\u003e\n    \u003cli\u003eDispense the material into the required thermal interface gap.\u003c\/li\u003e\n    \u003cli\u003eConfirm dispensing settings and assembly pressure under actual production conditions.\u003c\/li\u003e\n    \u003cli\u003ePerform application-specific thermal testing before mass production.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- CTA --\u003e\n  \u003cdiv style=\"background:#f0f7fb;padding:25px;border-radius:8px;border-left:4px solid #0879bb;\"\u003e\n    \u003ch3 style=\"color:#086da9;margin:0 0 10px;font-size:20px;\"\u003e\n      Looking for a Thermal Gap Filling Solution?\n    \u003c\/h3\u003e\n\n    \u003cp style=\"margin:0 0 15px;\"\u003e\n      Contact OPUTE for TC-30 technical specifications,\n      packaging options, samples and thermal gap\n      filling recommendations. Share your gap dimensions,\n      dispensing process and thermal requirements\n      with our team.\n    \u003c\/p\u003e\n\n    \u003ca href=\"mailto:info@evopute.com?subject=TC-30%20Thermal%20Putty%20Inquiry\" style=\"display:inline-block;background:#0879bb;color:#ffffff;padding:11px 23px;text-decoration:none;border-radius:5px;font-weight:bold;\"\u003e\n      Request a Quote\n    \u003c\/a\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- DISCLAIMER --\u003e\n  \u003cp style=\"font-size:12px;color:#7a8791;margin-top:20px;\"\u003e\n    Technical information is based on OPUTE TC-30\n    Technical Data Sheet, revision A\/0,\n    dated December 3, 2024.\n    Product suitability should be confirmed through\n    application-specific testing.\n  \u003c\/p\u003e\n\n\u003c\/div\u003e\n","brand":"OPUTE Global","offers":[{"title":"Default Title","offer_id":60459896111390,"sku":null,"price":0.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1090\/7890\/5118\/files\/OPUTE_Thermal_Putty_3W_04_800_800.png?v=1792735632","url":"https:\/\/www.oputeglobal.com\/products\/opute-3-w-m-k-thermal-putty-for-electronic-gap-filling-and-heat-dissipation","provider":"OPUTE Global","version":"1.0","type":"link"}