{"product_id":"opute-2-0-w-m-k-silicone-thermal-gel-thermal-gap-filler-for-electronic-components-led-cooling","title":"OPUTE 1.0 W\/m·K Silicone Thermal Gel – Thermal Gap Filler for Electronic Components \u0026 LED Cooling","description":"\n\u003cdiv style=\"font-family:Arial,Helvetica,sans-serif;color:#263746;line-height:1.7;font-size:15px;max-width:1200px;margin:auto;\"\u003e\n\n  \u003c!-- PRODUCT OVERVIEW --\u003e\n  \u003cdiv style=\"border-bottom:2px solid #0879bb;padding-bottom:15px;margin-bottom:25px;\"\u003e\n    \u003ch2 style=\"font-size:27px;color:#086da9;margin:0 0 12px;\"\u003e\n      TF-10 Two-Component Thermal Gel\n    \u003c\/h2\u003e\n    \u003cp style=\"margin:0;\"\u003e\n      OPUTE TF-10 is a two-component thermal gap-filling\n      material with a thermal conductivity of 1.0 W\/m·K.\n      Designed to fill gaps between heat-generating\n      components and heat sinks, it provides efficient\n      heat transfer, good conformability and low\n      compression force. The material can be applied\n      through dispensing and maintains its shape after\n      application. Once cured, it can be peeled off\n      for removal.\n    \u003c\/p\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- KEY SPECIFICATIONS --\u003e\n  \u003cdiv style=\"display:flex;flex-wrap:wrap;gap:12px;margin-bottom:30px;\"\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e1.0\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eThermal Conductivity (W\/m·K)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003e1:1\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eMixing Ratio (A:B)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:21px;font-weight:bold;color:#0879bb;\"\u003e-50~200°C\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eOperating Temperature\u003c\/div\u003e\n    \u003c\/div\u003e\n\n    \u003cdiv style=\"flex:1 1 140px;background:#eef6fb;padding:18px;text-align:center;border-radius:7px;\"\u003e\n      \u003cdiv style=\"font-size:24px;font-weight:bold;color:#0879bb;\"\u003eUL94 V-0\u003c\/div\u003e\n      \u003cdiv style=\"font-size:12px;\"\u003eFlammability Rating (TDS)\u003c\/div\u003e\n    \u003c\/div\u003e\n\n  \u003c\/div\u003e\n\n  \u003c!-- FEATURES --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Key Features \u0026amp; Benefits\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003eEfficient Heat Transfer:\u003c\/strong\u003e Thermal conductivity of 1.0 W\/m·K helps transfer heat between components and cooling surfaces.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eLow Compression Force:\u003c\/strong\u003e Good conformability helps the material fit closely against mating surfaces.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eShape Stability:\u003c\/strong\u003e Dispensed gap-filling material maintains its form after application.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eWide Operating Temperature Range:\u003c\/strong\u003e Designed for use from -50°C to 200°C.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eRemovable After Curing:\u003c\/strong\u003e The cured material can be peeled off for removal.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eTwo-Component System:\u003c\/strong\u003e A and B components are mixed at a 1:1 ratio.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- APPLICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Applications\n  \u003c\/h3\u003e\n\n  \u003cp\u003e\n    TF-10 is intended for thermal gap filling between\n    heat sources and heat sinks. Potential electronic\n    applications include:\n  \u003c\/p\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eElectronic components and heat sinks\u003c\/li\u003e\n    \u003cli\u003ePower electronics thermal interfaces\u003c\/li\u003e\n    \u003cli\u003eElectronic modules requiring conformable gap filling\u003c\/li\u003e\n    \u003cli\u003eHeat-generating assemblies with uneven mating surfaces\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003cp style=\"font-size:13px;color:#657482;margin-bottom:28px;\"\u003e\n    Specific application suitability should be verified\n    through testing under actual operating conditions.\n  \u003c\/p\u003e\n\n  \u003c!-- TECHNICAL SPECIFICATIONS --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Technical Specifications\n  \u003c\/h3\u003e\n\n  \u003cdiv style=\"width:100%;overflow-x:auto;margin-bottom:30px;\"\u003e\n    \u003ctable style=\"border-collapse:collapse;width:100%;font-size:13px;\"\u003e\n      \u003cthead\u003e\n        \u003ctr style=\"background:#0879bb;color:#ffffff;\"\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eProperty\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTF-10\u003c\/th\u003e\n          \u003cth style=\"padding:12px;text-align:left;\"\u003eTest Method\u003c\/th\u003e\n        \u003c\/tr\u003e\n      \u003c\/thead\u003e\n      \u003ctbody\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eComponent System\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eTwo-Component (A+B)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eColor Before Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eA: White \/ B: Pink\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVisual\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eViscosity Before Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eA: 250,000 \/ B: 250,000 mPa·s\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D2196\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eMixing Ratio (A:B)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e1:1\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eColor After Mixing\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eGrayish White\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eVisual\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Conductivity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e\u003cstrong\u003e1.0 W\/m·K\u003c\/strong\u003e\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eThermal Resistance (@20 psi, 1 mm)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e2.2 °C·in²\/W\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D5470\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eHardness\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e35–60 Shore 00\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D2240\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eDensity\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e2.1 g\/cm³\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D792\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eExtrusion (90 psi, 50 cc, 1 min)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e40 (unit not specified in TDS)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eDielectric Breakdown Strength\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e11.2 kV\/mm\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D149\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eDielectric Constant (@1 MHz)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e6.79\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eASTM D150\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr style=\"background:#f2f7fa;\"\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eOperating Temperature\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e-50°C to 200°C\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003e—\u003c\/td\u003e\n        \u003c\/tr\u003e\n        \u003ctr\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eFlammability Rating\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eUL94 V-0 (TDS stated)\u003c\/td\u003e\n          \u003ctd style=\"padding:10px;border:1px solid #dce5ed;\"\u003eGB\/T 10707-2008\u003c\/td\u003e\n        \u003c\/tr\u003e\n      \u003c\/tbody\u003e\n    \u003c\/table\u003e\n  \u003c\/div\u003e\n\n  \u003c!-- CURING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Mixing \u0026amp; Curing\n  \u003c\/h3\u003e\n\n  \u003cp\u003e\n    TF-10 consists of two components that should be\n    mixed at an A:B ratio of 1:1. The TDS lists the\n    following curing conditions:\n  \u003c\/p\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:15px;\"\u003e\n    \u003cli\u003e25°C: 30 minutes (as stated in TDS)\u003c\/li\u003e\n    \u003cli\u003e100°C: 120 minutes (as stated in TDS)\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003cp style=\"font-size:13px;color:#657482;margin-bottom:28px;\"\u003e\n    Please confirm the applicable curing schedule\n    with OPUTE technical support before processing.\n  \u003c\/p\u003e\n\n  \u003c!-- PACKAGING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Packaging \u0026amp; Storage\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003e\n\u003cstrong\u003eStandard Packaging:\u003c\/strong\u003e 50 ml, 100 ml and 300 ml per cartridge.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eCustom Packaging:\u003c\/strong\u003e Other packaging configurations available upon request, subject to confirmation.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eShelf Life:\u003c\/strong\u003e 6 months.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eStorage:\u003c\/strong\u003e Store sealed in a cool, dry environment.\u003c\/li\u003e\n    \u003cli\u003e\n\u003cstrong\u003eTransportation:\u003c\/strong\u003e Classified as non-dangerous goods according to the product TDS.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- HANDLING --\u003e\n  \u003ch3 style=\"font-size:21px;color:#086da9;border-bottom:1px solid #d5e5ef;padding-bottom:9px;\"\u003e\n    Application \u0026amp; Handling Guidelines\n  \u003c\/h3\u003e\n\n  \u003cul style=\"padding-left:22px;margin-bottom:28px;\"\u003e\n    \u003cli\u003eEnsure that the surfaces to be covered are clean and dry.\u003c\/li\u003e\n    \u003cli\u003eMix components A and B at the specified 1:1 ratio.\u003c\/li\u003e\n    \u003cli\u003eApply the mixed material to the required thermal gap.\u003c\/li\u003e\n    \u003cli\u003eFollow the curing conditions confirmed by OPUTE technical support.\u003c\/li\u003e\n    \u003cli\u003eReseal unused material before storage.\u003c\/li\u003e\n    \u003cli\u003ePerform application testing before mass production.\u003c\/li\u003e\n  \u003c\/ul\u003e\n\n  \u003c!-- CTA --\u003e\n  \u003cdiv style=\"background:#f0f7fb;padding:25px;border-radius:8px;border-left:4px solid #0879bb;\"\u003e\n    \u003ch3 style=\"color:#086da9;margin:0 0 10px;font-size:20px;\"\u003e\n      Looking for a Thermal Gap Filling Solution?\n    \u003c\/h3\u003e\n\n    \u003cp style=\"margin:0 0 15px;\"\u003e\n      Contact OPUTE to discuss TF-10 thermal gel,\n      application gap dimensions, dispensing requirements,\n      packaging options and technical specifications.\n      Our team can help evaluate the material for your\n      electronic thermal management application.\n    \u003c\/p\u003e\n\n    \u003ca href=\"mailto:info@evopute.com?subject=TF-10%20Thermal%20Gel%20Inquiry\" style=\"display:inline-block;background:#0879bb;color:#ffffff;padding:11px 23px;text-decoration:none;border-radius:5px;font-weight:bold;\"\u003e\n      Request a Quote\n    \u003c\/a\u003e\n  \u003c\/div\u003e\n\n  \u003cp style=\"font-size:12px;color:#7a8791;margin-top:20px;\"\u003e\n    Technical information is based on OPUTE TF-10\n    Technical Data Sheet, revision A\/0, dated\n    March 22, 2024. Customers should conduct\n    application-specific testing before use.\n  \u003c\/p\u003e\n\n\u003c\/div\u003e\n","brand":"OPUTE Global","offers":[{"title":"Default Title","offer_id":60374416818462,"sku":null,"price":0.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1090\/7890\/5118\/files\/OPUTE_1W_Thermal_Gel_01_800_800.png?v=1792650245","url":"https:\/\/www.oputeglobal.com\/products\/opute-2-0-w-m-k-silicone-thermal-gel-thermal-gap-filler-for-electronic-components-led-cooling","provider":"OPUTE Global","version":"1.0","type":"link"}